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IPC-A-610 Acceptability of Electronic Assemblies
IPC-A-600 Acceptability of Printed Boards
Dewetting in soldering: What it looks like and why it happens
Control Plan - rules, recommendations, example
Soldering - non-wetting, is it a defect?
Soldering of wires and cables
MSA: What is Measurement Systems Analysis?
SPC: What is Statistical Process Control?
G8D - Global 8D Method
8D Method: How to solve problems?
Copper dissolution in the soldering process
Effect of sulfur on SMD resistors
Five-step design method by Elon Musk
DFS : Design for Serviceability
DFC : Design for Cost
DFE : Design For Environment
DFM : Design For Manufacturing
DFR : Design for Reliability
DFT : Design for Test
DFA : Design for Assembly
DFX : Design for Excellence
Anode and cathode
Corrosion of electrical connectors
Electrical connectors contact finish
Types of FMEA analyses
FMEA history
Rework, Repair or Modification
Dendrites and corrosion in electronics
Moisture vs. component MSL levels
Wave soldering profile
Reflow soldering profile
Soldering : Flux
Soldering : SMT pastes
Soldering : lead-free alloys
Soldering : Leaded alloys
Soldering : Introduction
IPC-A-610H : Target condition removed
Poka Yoke
Control chart
Check sheet
Stratification
Ishikawa diagram
Process flowchart
Scatter diagram
Pareto diagram
Histogram.
P-FMEA : Introduction
D-FMEA : P-diagram tool
IPC : Requirements flowdown
IPC : Order of precedence
IPC : Conditions explained
IPC : Product classes in electronics
IPC: Translation to other languages
What is IPC?
D-FMEA : Scope
D-FMEA : Introduction
